System-in-Package RF Design and Applications Review

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(More customer reviews)Gaynor does a very good job of explaining the practical details for SIP. The book covers the RF design aspects quite well, but is also very "hands on" by showing many practical examples. It also gives a great perspective on manufacturing considerations & techniques. This is a great book for an RF designer at any level to keep on the shelf.


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In the past few years, System in Package (SiP) design has fueled a revolution in the use of modules in wireless devices due its effectiveness in meeting the increasingly demanding requirements for reliability, shielding, performance, size, and cost. Here's the first comprehensive resource on SiP design techniques that offers designers state-of-the-art packaging know-how. Moreover, the book provides numerous examples that illustrate real-world capabilities, constraints, trade-offs, and options at every step.

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